IC having viabar interconnection and related method
AssigneeInternational Business Machines Corporation
InventorsDureseti Chidambarrao, Stephen E. Greco, Kia S. Low
Life of this patent
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Abstract
An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.
Claims17
An integrated circuit (IC) comprising:
- a first metal layer having wiring running in a first direction;
- a second metal layer having wiring running in a second direction perpendicular to the first direction;
- and
- a first via layer between the first metal layer and the second metal layer, the first via layer comprising a single viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer,
- wherein the first via layer is a distinct layer from each of the first metal layer and the second metal layer, and wherein at least a portion of the first via layer extends to a height equal to a height of the second metal layer.
An integrated circuit (IC) comprising:
- a first metal layer having wiring running in a first direction;
- a second metal layer having wiring running in a second direction perpendicular to the first direction;
- a wrong way metal extending in a direction perpendicular to the second direction within the second metal layer and a pair of vias interconnecting the wrong way metal to wiring in the first metal layer;
- and
- a first via layer between the first metal layer and the second metal layer, the first via layer comprising:
- a single viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer,
- wherein the viabar has a width that is substantially identical to a width of another via in the via layer, and
- wherein the first via layer is a distinct layer from each of the first metal layer and the second metal layer, and wherein at least a portion of the first via layer extends to a height equal to a height of the second metal layer.
Dependencies are inferred from the claim text.