Semiconductor device includes a ceramic substrate and heat sink
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorsShogo Mori, Eiji Kono, Keiji Toh
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Abstract
A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate. The heat sink may include a housing that is made of a metal sheet and radiating fins that are fixed in the housing and made of aluminum. The metal sheet may have a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.
Claims1
A semiconductor device comprising:
- an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate;
- a semiconductor chip mounted on one surface of the insulating substrate;
- and
- a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate,
- wherein the heat sink includes:
- a housing that is made of a metal sheet:
- and
- radiating fins that are fixed in the housing and made of aluminum,
- wherein the metal sheet has a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.
Dependencies are inferred from the claim text.