Structure of metal e-fuse

An electronic fuse comprising:

• a via of a first conductive material having a bottom and sidewalls with said bottom being formed directly on top of a dielectric layer;
• a first conductive path being formed on top of said dielectric layer at a first side of said via and being separated from said sidewalls of said via by a void;
• and
• a second conductive path being formed on top of said dielectric layer at a second different side of said via and being in conductive contact with said via through said sidewalls,
• wherein a portion of said sidewalls being separated from said first conductive path is covered by a conductive liner, and wherein said first and second conductive paths being made of a second conductive material.

An electronic fuse comprising:

• a via of a first conductive material having a bottom and sidewalls, said sidewalls being covered by a conductive liner, said bottom being formed directly on top of a dielectric layer;
• and
• a first and a second conductive path of a second conductive material formed on top of said dielectric layer, said first and second conductive paths being conductively connected to each other through, and only through, said via at said sidewalls,
• wherein one or more voids exist adjacent to said sidewalls of said via inside at least one of said first and second conductive paths, wherein said voids being caused by electro-migration and occupying a substantial portion of a cross-section of said at least one of said first and second conductive paths.