Methods of preparing thin films by electroless plating
AssigneeNorth Carolina Agricultural and Technical State University
InventorsShamsuddin Ilias, Mohammad A. Islam
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Abstract
The present invention provides methods of controlling properties of a thin film applied to a substrate whereby the properties of the thin film may be controlled by the surface morphology of the substrate. Methods of increasing a deposition rate of an electroless plating process applied to a substrate, controlling the grain size distribution and/or grain size of a thin film applied to a substrate and maintaining a uniform overpotential of an electroless plating process on a substrate are also provided.
Claims14
A method of preparing a palladium thin film on an activated metal substrate by electroless plating, the method comprising:
- applying at least one surfactant to said activated metal substrate, wherein said surfactant is dodecyl trimethylammonium bromide (DTAB), dodecyltrimethylammonium chloride (DTAC) or a polyethylene glycol tert-octylphenyl ether and wherein the concentration of said surfactant is at least at the critical micelle concentration of said surfactant.
A method of preparing a palladium thin film on an activated metal substrate by electroless plating, the method comprising:
- applying at least one surfactant to said activated metal substrate,
- wherein the concentration of said surfactant is at least the critical micelle concentration of said surfactant,
- wherein said surfactant is dodecyl trimethylammonium bromide (DTAB) or dodecyltrimethylammonium chloride (DTAC), and
- wherein said activated metal substrate is microporous.
Dependencies are inferred from the claim text.