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US 8,298,325 B2Granted
Electroless deposition from non-aqueous solutions
AssigneeLam Research Corporation
InventorsEugenijus Norkus, Jane Jaciauskiene, Yezdi Dordi
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Abstract
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
Claims17
A non-aqueous electroless copper plating solution, comprising;
- an anhydrous copper salt component;
- an anhydrous cobalt salt component;
- a non-aqueous complexing agent;
- and
- a non-aqueous solvent;
- wherein the solution is non-aqueous, being without water so as to prevent oxidation when applied on a reactive metal surface.
3 more elements
A non-aqueous electroless copper plating solution, comprising;
- an anhydrous copper salt component;
- an anhydrous cobalt salt component;
- a polyamine complexing agent;
- a halide source;
- and
- a non-aqueous solvent;
- wherein the solution is non-aqueous, being without water so as to prevent oxidation when applied on a reactive metal surface.
4 more elements
Dependencies are inferred from the claim text.