Semiconductor integrated circuit device and method of arranging wirings in the semiconductor integrated circuit device
AssigneeKabushiki Kaisha Toshiba
InventorEiichi Makino
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AssigneeKabushiki Kaisha Toshiba
InventorEiichi Makino
Estimating the term…
A semiconductor integrated circuit device includes a first component, a second component, a plurality of first, second and third contacts, and a plurality of signal lines having a plurality of first wires, and connecting the first and second component, each of the first wires having a first, second, third and fourth part, each of the parts having a resistivity, the second part having a first resistivity, a different value of the first resistance being set for each of the plurality of first wires, the first, third and fourth parts having a second or third resistivity which is lower than the first resistivity, the first and second part being electrically connected in series by the first contact, the second and third part being electrically connected in series by the second contact, and the third and fourth part being electrically connected in series by the third contact.
A semiconductor integrated circuit device comprising:
A semiconductor integrated circuit device comprising:
Dependencies are inferred from the claim text.