Semiconductor device having anti-warping sheet
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorsShogo Mori, Eiji Kono, Keiji Toh
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Abstract
A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate and at least one anti-warping sheet disposed on at least one surface of the heat sink. The anti-warping sheet is made of a metal sheet having a coating layer and has coefficient of thermal expansion between those of the insulating substrate and the heat sink.
Claims10
A semiconductor device comprising:
- an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate;
- a semiconductor chip mounted on one surface of the insulating substrate;
- a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate;
- and
- at least one anti-warping sheet disposed on at least one of an upper outer surface or a lower outer surface of the heat sink,
- wherein the anti-warping sheet is made of a metal sheet having a coating layer and has a coefficient of thermal expansion between those of the insulating substrate and the heat sink.
A semiconductor device comprising:
- an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate;
- a semiconductor chip mounted on one surface of the insulating substrate;
- and
- a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate, wherein
- the heat sink includes:
- a housing that is made of a metal sheet:
- and
- radiating fins that are fixed in the housing and made of aluminum, wherein
- the metal sheet has a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.
Dependencies are inferred from the claim text.