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US 8,283,697 B2Granted
Internal combustion engine igniter semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorKatsunori Ueno
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Abstract
An internal combustion engine igniter semiconductor device is disclosed which is low cost yet secures energy withstand and reverse surge withstand capability. An IGBT includes a clamping diode between a collector electrode and a gate electrode. The IGBT has two n-type buffer layers of differing impurity concentrations between a p+ substrate and an n-type base layer of the IGBT, wherein the total thickness of the two-layer buffer layer is 50 μm or less, and the overall impurity amount is 20×1013 cm−2 or less.
Claims7
An internal combustion engine igniter semiconductor device, comprising:
- a semiconductor substrate including a first conductive collector layer, a second conductive buffer layer, and a second conductive base layer in that order, the second conductive buffer layer having a second buffer layer with a higher impurity concentration than that of the second conductive base layer disposed on the second conductive base layer side, and a first buffer layer with a higher impurity concentration than that of the second buffer layer disposed on the first conductive collector layer side;
- an insulated gate bipolar transistor including a first conductive base region disposed on a surface layer of the second conductive base layer of the semiconductor substrate, a gate electrode across a gate insulating film on a surface of the first conductive base region sandwiched between a second conductive emitter region disposed on a surface layer in the first conductive base region and the second conductive base layer surface, and an emitter electrode in common contact with a collector electrode, the second conductive base layer, and the second conductive emitter region on the first conductive collector layer surface;
- a clamp diode between the gate electrode and the collector electrode with the gate electrode side as an anode side;
- and
- a control circuit which, being on the same semiconductor substrate as the insulated gate bipolar transistor, and enclosed in a ring form by an other conductive region connected by wire to the emitter electrode, detects an abnormal condition of the insulated gate bipolar transistor using a signal from the emitter electrode, and prevents a breakdown of the insulated gate bipolar transistor by controlling a gate voltage, wherein
- a total thickness of the first buffer layer and second buffer layer is 50 μm or less, and an overall impurity amount of the two layers is 20×1013 cm−2 or less, and
- the thickness of the first buffer layer is from 1 to 10 μm or less, the impurity concentration of the first buffer layer is in the range of 2×1016 cm−3 to 8×1016 cm−3, the thickness of the second buffer layer is 49 μm or less, and the impurity concentration of the second buffer layer is in the range of 1×1016 cm−3 to 4×1016 cm−3.
4 more elements
Dependencies are inferred from the claim text.