Substrate processing apparatus and substrate stage used therein
AssigneeTokyo Electron Limited
InventorDaisuke Hayashi
Life of this patent
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Abstract
A substrate stage includes a stage upon which a wafer is placed, a heater element installed within the stage, an upright support that ranges upright from a bottom of a processing chamber and includes a tubular member that includes a small tube portion, a large tube portion and a middle portion attached to and joins the small tube portion and the large tube portion to one another, an outer heat shield plate disposed so as to surround the outer side of the small tube portion and an inner heat shield plate. The outer heat shield plate and the inner heat shield plate are disposed so that an inner edge of the outer heat shield plate and an outer edge of the inner heat shield plate overlap along the entire circumference.
Claims7
A substrate processing apparatus that includes a substrate stage installed inside a processing chamber and executes a specific type of processing on a substrate placed on said substrate stage, wherein:
- said substrate stage comprises:
- a stage upon which the substrate is placed;
- a heater installed inside said stage and heats the substrate placed on said stage;
- an upright support that ranges upright from a bottom of said processing chamber to support said stage and comprises a tubular member that includes a small tube portion, a large tube portion assuming an inner diameter greater than the outer diameter of said small tube portion and a middle portion attached to and joining said small tube portion and said large tube portion to one another;
- an outer heat shield plate disposed so as to surround said small tube portion on an outer side thereof, and blocks the heat from said heater on said outer side of said small tube portion;
- and
- an inner heat shield plate disposed so as to block the heat from said heater on the inner side of said large tube portion;
- and
- said outer heat shield plate and said inner heat shield plate are disposed so that an inner edge of said outer heat shield plate and an outer edge of said inner heat shield plate overlap along the entire circumference, in a plan view taken from said stage.
A substrate stage upon which a substrate to undergo a specific type of processing inside a processing chamber is placed, comprising:
- a stage upon which the substrate is placed;
- a heater installed inside said stage and heats the substrate placed on said stage;
- a upright support that ranges upright from a bottom of said processing chamber to support said stage and comprises a tubular member that includes a small tube portion, a large tube portion assuming an inner diameter greater than an outer diameter of said small tube portion and a middle portion attached to and joining said small tube portion and said large tube portion to one another;
- an outer heat shield plate disposed so as to surround said small tube portion on an outer side thereof, and blocks the heat from said heater on the outer side of said small tube portion;
- and
- an inner heat shield plate disposed so as to block the heat from said heater on the inner side of said large tube portion, wherein:
- said outer heat shield plate and said inner heat shield plate are disposed so that an inner edge of said outer heat shield plate and an outer edge of said inner heat shield plate overlap along an entire circumference, in a plan view taken from said stage.
Dependencies are inferred from the claim text.