Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries
AssigneeMicron Technology, Inc.
InventorMichael Andreas
Life of this patent
Estimating the term…
Abstract
Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries are disclosed. A method in accordance with one embodiment includes sequentially exposing a portion of a semiconductor workpiece surface to a first chemistry having a first chemical composition and a second chemistry having a second chemical composition different than the first. Prior to rinsing the portion of the workpiece surface, the portion is sequentially exposed to the first and second chemistries again. The first and second chemistries are removed from the portion, and, after sequentially exposing the portion to each of the first and second chemistries at least twice, and removing the first and second chemistries, the portion is rinsed and dried.
Claims40
A method for processing a semiconductor workpiece, comprising:
- positioning a process head proximate to a semiconductor workpiece with a region between the process head and the workpiece, the region being fixed relative to the process head;
- while the process head is proximate to the semiconductor workpiece, changing the chemistry of the region by exposing a portion of the semiconductor workpiece surface to a first chemistry having a first chemical composition, removing the first chemistry, exposing the portion to a second chemistry having a second chemical composition different than the first chemical composition, and removing the second chemistry;
- prior to rinsing the portion of the workpiece surface, sequentially exposing the portion to the first and second chemistries again without rinsing the portion of the workpiece surface between the operations of exposing the portion to the first chemistry and exposing the portion to the second chemistry again;
- and
- rinsing and drying the portion after sequentially exposing the portion to each of the first and second chemistries at least twice, and removing the first and second chemistries.
A method for processing a semiconductor workpiece, comprising:
- positioning a process head proximate to a semiconductor workpiece with a region between the process head and the workpiece, the region being fixed relative to the process head;
- while the process head is proximate to the semiconductor workpiece, changing the chemistry of the region and reducing attractive forces between the semiconductor workpiece surface and an adjacent particle via repeated exposure of the surface to each of a first chemistry and a second chemistry having a chemical composition different than that of the first chemistry;
- after repeatedly exposing the surface to each of the first and second chemistries and prior to rinsing the surface, removing the first and second chemistries and the particle from the surface;
- and
- rinsing the surface after repeatedly exposing the surface to each of the first and second chemistries and removing the first and second chemistries and the particle from the surface.
A method for processing a semiconductor workpiece, comprising:
- carrying a semiconductor workpiece;
- positioning a process head proximate to the semiconductor workpiece with a region between the process head and the workpiece, the region being fixed relative to the process head;
- while the process head is proximate to the semiconductor workpiece, sequentially changing a liquid chemistry of the region to sequentially expose the semiconductor workpiece surface at intervals of ten seconds or less, without spinning the workpiece;
- prior to rinsing the surface of the workpiece, removing the liquid chemistry from the workpiece surface;
- and
- rinsing and drying the workpiece surface.
Dependencies are inferred from the claim text.