Integrated circuit system with sealring and method of manufacture thereof

A method of manufacture of an integrated circuit system comprising:

• forming an insulation region and a first active portion in a base layer, the insulation region adjacent the first active portion;
• filling an insulator in the insulation region wherein the insulator is entirely around a perimeter of a main chip region including an integrated circuit;
• forming a contact directly on and within planar extents of the insulator in the insulation region;
• forming a layer one directly on the contact;
• forming an upper via over the layer one;
• forming at least one sealring having an upper layer directly on the upper via with the sealring surrounding and isolating an active surface area in the main chip region;
• and
• forming a passivation layer directly on the upper layer.

An integrated circuit system comprising:

• an insulation region in a base layer;
• an insulator in the insulation region wherein the insulator is over an active portion and around a perimeter of a main chip region including an integrated circuit;
• a contact directly on and within planar extents of the insulator in the insulation region;
• and
• at least one sealring having an upper layer over the contact with the sealring surrounding and isolating an active surface area in the main chip region.