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US 8,282,999 B2Granted
Spin-on film processing using acoustic radiation pressure
AssigneeMicron Technology, Inc.
InventorsNishant Sinha, Gurtej S. Sandhu, John Smythe
Life of this patent
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Abstract
An apparatus and process operate to impose sonic pressure upon a spin-on film liquid mass that exhibits a liquid topography and in a solvent vapor overpressure to alter the liquid topography. Other apparatus and processes are disclosed.
Claims27
A process, comprising:
- forming a spin-on film liquid topography upon a semiconductive substrate;
- imposing a solvent vapor at an overpressure on the spin-on film liquid topography;
- imposing sonic radiation pressure onto the spin-on film liquid topography to alter the liquid topography;
- and
- moving a mounting substrate, to which a source of the sonic radiation pressure is attached, in an eccentric oscillatory motion in a plane parallel to the semiconductor substrate while imposing the sonic radiation pressure.
2 more elements
A process, comprising:
- forming a spin-on film liquid topography upon a semiconductive substrate;
- imposing sonic radiation pressure from a source onto the spin-on film liquid topography to alter the liquid topography while eccentrically moving the source relative to the liquid topography by moving a mounting substrate, to which the source of the sonic radiation pressure is attached, in an eccentric oscillatory motion in a plane parallel to the semiconductor substrate;
- and
- imposing a solvent vapor at an overpressure on the spin-on film liquid topography.
1 more element
A process, comprising:
- forming a spin-on film liquid topography upon a semiconductive substrate;
- imposing a spin-on liquid solvent overpressure upon the spin-on film liquid;
- and
- imposing sonic radiation pressure onto the spin-on film liquid topography to alter the liquid topography, wherein imposing the sonic radiation pressure includes modulating at least one of frequency or amplitude of an acoustic wave emanating from one or more sources imposing the sonic radiation pressure, the one or more sources attached to a mounting substrate, the mounting substrate moving in an eccentric oscillatory motion in a plane parallel to the semiconductive substrate, while imposing the sonic radiation pressure.
1 more element
Dependencies are inferred from the claim text.