3-dimensional multi-layered modular computer architecture

3-Dimensional multi-layered modular computer (3DMC) comprising:

• one or more CPU layers, each of said one or more CPU layers having one or more CPU functions or cores capable of performing data processing and caching tasks;
• one or more volatile memory layers capable of temporarily storing data necessary for the operation of said one or more CPU functions;
• and
• one or more Input/Output (I/O) interface layers for data communication with other functions;
• and
• a plurality of Thermal Conducting Rods (TCRs) capable of substantially conducting and removing heat generated in said one or more CPU layers, said one or more volatile memory layers and said one or more I/O interface layers to an external medium,
• wherein said one or more CPU layers, said one or more volatile memory layers and said one or more I/O interface layers are stacked in parallel, are user-removable, are electrically connected to create a computing apparatus, and wherein each of the layers is formed from encapsulating material having one or more internal cavities for components selected from the group consisting of chip dice, passive components, active components, and conductors traces, and wherein each of said plurality of TCRs passes through the layers perpendicular to a larger face of the layers.