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US 8,274,600 B2Granted
Camera module package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHo Kyoum Kim, Gab Yong Kim, Hyung Chan Kwak
Life of this patent
Estimating the term…
Abstract
A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.
Claims7
A camera module package comprising:
- a housing having an inner space in an upper portion thereof;
- a lens barrel coupled to the housing through the inner space and receiving one or more lenses;
- an image sensor including an imaging area converting light, falling thereon via the lens, into an electrical signal, and a sensor contact pad formed on an upper side thereof;
- a board including a cavity receiving the image sensor, and an external contact pad formed on an upper side thereof;
- and
- a connection part electrically connecting the external contact pad to the sensor contact pad,
- wherein the cavity has substantially a same depth as a thickness of the image sensor such that the upper side of the image sensor and the upper side of the board are on a same level, and
- wherein the connection part is provided using screen-printing and covers the sensor contact pad and the external contact pad integrally to electrically connect the sensor contact pad to the external contact pad.
5 more elements
Dependencies are inferred from the claim text.