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US 8,274,302 B2Granted
Wafer and test method thereof
AssigneeHimax Technologies Limited
InventorsTzong-Yau Ku, Chien-Ru Chen, Chin-Tien Chang, Ying-Lieh Chen, Lin-Kai Bu
Life of this patent
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Abstract
A wafer and a test method thereof are provided. The invention utilizes a first group of probes to perform a high voltage stress (HVS) test on a first chip, and utilizes a second group of probes to perform a function test on a second chip, where a period of the high voltage stress test overlaps a period of the function test, thereby greatly decreasing the test time of the wafer.
Claims7
A wafer test method, comprising:
- selecting a first chip from a wafer to be tested to perform an HVS test;
- and
- selecting a second chip from the wafer to be tested to perform a function test, wherein a period of the HVS test overlaps a period of the function test.
Dependencies are inferred from the claim text.