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US 8,274,162 B2Granted
Apparatus and method for reduced delamination of an integrated circuit module
AssigneeTriQuint Semiconductor, Inc.
InventorsDean L. Monthei, Antonio Espinoza, Waldemar J. Holgado
Life of this patent
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Abstract
An apparatus and method for reducing delamination of an integrated circuit module is disclosed. The integrated circuit module includes a laminate substrate. The integrated circuit module further includes an integrated circuit die operably coupled with the laminate substrate and a plastic semiconductor package overmolded with the laminate substrate. The laminate substrate includes a die attach pad including a plurality of metal oxide regions and non-oxidized metal regions disposed on the die attach pads.
Claims19
An integrated circuit, comprising:
- a laminate substrate;
- and
- one or more die attach pads disposed on the laminate substrate, the one or more die attach pads including one or more metal oxide regions and one or more non-oxidized metal regions, the one or more metal oxide regions and the one or more non-oxidized metal regions being directly disposed on a common surface area of each of the one or more die attach pads, wherein the one or more metal oxide regions and the one or more non-oxidized metal regions are disposed in a pattern such that current is configured to flow predominately through the one or more non-oxidized metal regions of the pattern, wherein the one or more metal oxide regions and the one or more non-oxidized metal regions of the one or more die attach pads are configured to receive a die attach epoxy material to facilitate coupling of an integrated circuit die with the laminate substrate.
An integrated circuit module, comprising:
- a laminate substrate, wherein the laminate substrate comprises one or more die attach pads disposed on the laminate substrate, the one or more die attach pads including one or more metal oxide regions and one or more non-oxidized metal regions, the one or more metal oxide regions and the one or more non-oxidized metal regions being directly disposed on a common surface area of each of the one or more die attach pads;
- a die attach epoxy material disposed on the one or more metal oxide regions and the one or more non-oxidized metal regions of the one or more die attach pads;
- and
- an integrated circuit die coupled with the one or more die attach pads of the laminate substrate using the die attach epoxy material, wherein the one or more metal oxide regions and the one or more non-oxidized metal regions are disposed in a pattern such that current of the integrated circuit die is configured to flow predominately through the one or more non-oxidized metal regions of the pattern.
1 more element
Dependencies are inferred from the claim text.