Method and system for intra-printed circuit board communication via waveguides

Abstract

Methods and systems for intra-printed circuit board communication via waveguides are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more waveguides integrated on a printed circuit board. The integrated circuits may be bonded to the printed circuit board. The waveguides may be configured via switches integrated within each of the plurality of integrated circuits. The one or more signals may include microwave signals. The one or more waveguides may be configured for communicating microwave signals with a frequency of 60 GHz or greater. The communication of the one or more signals may be configured via a low frequency control signal, which may include a digital signal. The one or more waveguides may include metal and/or semiconductor layers deposited on and/or embedded within the printed circuit board.

Dependencies are inferred from the claim text.