BGA footprint pattern for increasing number of routing channels per PCB layer

A printed circuit board (PCB) including multiple layers and a ball grid array (BGA) footprint pattern, the PCB comprising:

• multiple first BGA footprint elements arranged in a first column, each of the first BGA footprint elements comprising a first via and a first BGA pad;
• and
• multiple second BGA footprint elements arranged in a second column, each of the second BGA footprint elements comprising a second via and a second BGA pad,
• a relative spacing and an orientation between the first BGA footprint elements and the second BGA footprint elements producing three routing channels per layer of the multiple layers of the PCB for the first and second columns,
• a portion of the first via overlapping a portion of the first BGA pad and a center of the first via being rotated diagonally relative to a center of the first BGA pad such that the center of the first via relative to the center of the first BGA pad is at a first angle with respect to a first axis that crosses the center of the first via and at a second angle with respect to a second axis that crosses the center of the first via, the first angle and the second angle both being greater than zero degrees and less than ninety degrees, and
• a portion of the second via overlapping a portion of the second BGA pad and a center of the second via being rotated diagonally relative to a center of the second BGA pad such that the center of the second via relative to the center of the second BGA pad is at the first angle with respect to a first axis that crosses the center of the second via and at the second angle with respect to a second axis that crosses the center of the second via.

A printed circuit board (PCB) including multiple layers and a ball grid array (BGA) footprint pattern, the PCB comprising:

• multiple first BGA footprint elements arranged in a first column, each of the first BGA footprint elements comprising a first via and a first BGA pad,
• the first BGA pad and the first via having circular shapes, and
• the first via overlapping a portion of the first BGA pad and a center of the first via being rotated diagonally relative to a center of the first BGA pad such that the center of the first via relative to the center of the first BGA pad is at a first angle with respect to a first axis that crosses the center of the first via and at a second angle with respect to a second axis that crosses the center of the first via, the first angle and the second angle both being greater than zero degrees and less than ninety degrees;
• and
• multiple second BGA footprint elements arranged in a second column, each of the second BGA footprint elements comprising a second via and a second BGA pad,
• the second BGA pad and the second via having circular shapes,
• the second via overlapping a portion of the second BGA pad and a center of the second via being rotated diagonally relative to a center of the second BGA pad such that the center of the second via relative to the center of the second BGA pad is at the first angle with respect to a first axis that crosses the center of the second via and at the second angle with respect to a second axis that crosses the center of the second via,
• the center of the second via being located at a first distance and at a third angle relative to the center of the first via,
• relative spacings and orientations between the first BGA footprint elements and the second BGA footprint elements producing three routing channels per layer of the multiple layers of the PCB for the first and second columns, and
• an orientation of each of the second BGA footprint elements being reversed by 180 degrees from an orientation of each of the first BGA footprint elements on the PCB.