Load lock design for rapid wafer heating
AssigneeNovellus Systems, Inc.
InventorsMichael Rivkin, Ron Powell, Shawn Hamilton, Michael Nordin
Life of this patent
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Abstract
A semiconductor processing tool heats wafers using radiant heat and resistive heat in chamber or in a load lock where pressure changes. The wafers are heated in greater part with a resistive heat source until a transition temperature or pressure is reached, then they are heated in greater part with a radiant heat source. Throughput improves for the tool because of the wafers can reach a high temperature uniformly in seconds.
Claims18
A load lock for substantially uniform and rapid heating of a substrate in a pressure changing environment, the load lock comprising:
- a load lock housing comprising a window made from a radiation transmitting material, the load lock housing is configured to be attached to a vacuum source to reduce a pressure inside the load lock housing;
- a radiant heat source positioned outside of the load lock housing and arranged to transmit radiation through the window and to the substrate while the pressure inside the load lock housing is being reduced;
- a substrate support for supporting the substrate;
- and
- a resistive heat source arranged in the substrate support.
A method of heating a substrate in a load lock, the method comprising:
- providing the substrate on a substrate support positioned in a load lock housing, the load lock housing comprising a window made from a radiation transmitting material;
- heating the substrate with a radiant heat source through the window of the load lock housing, the radiant heat source positioned outside of the load lock housing, wherein a pressure in the load lock housing is reduced during heating;
- and
- heating the substrate with a resistive heat source arranged in the substrate support.
Dependencies are inferred from the claim text.