Method for manufacturing a semiconductor apparatus having a through-hole interconnection

A method for manufacturing a semiconductor apparatus having a through-hole interconnection, comprising the steps of:

• forming a first insulating layer on a first side of a semiconductor substrate;
• forming a first opening for a via hole that extends through the semiconductor substrate to the first insulating layer by etching the semiconductor substrate from a second side thereof, the step of forming the first opening including etching a portion of the semiconductor substrate defining an edge of the first opening at a boundary interface between the semiconductor substrate and the first insulating layer, thereby forming a recessed portion;
• forming a second insulating layer on an inside of the first opening so that sidewalls of the first opening and a bottom of the first opening are covered with the second insulating layer, the step of forming the second insulating layer including forming the second insulating layer such that the second insulating layer completely fills the recessed portion in the semiconductor substrate so that an inwardly facing surface of the second insulating layer along an entirety of the sidewall of the first opening is planar;
• forming a second opening for the via hole that is in registry with the first opening by etching (i) a portion of the second insulating layer that is formed on the bottom of the first opening and (ii) the first insulating layer formed on the first side of the semiconductor substrate, thereby forming the via hole;
• and
• forming in the via hole a conductive layer for the through-hole connection.