By-die-exposure for patterning of holes in edge die

A method of making holes, the method comprising:

• forming a photoresist layer over a top surface of a wafer, wherein the surface comprises a flat substantially horizontal inner region and a non-flat substantially rounded outer region, whereby first die areas are defined located completely on the inner region and second die areas are defined located at least partly on the non-flat substantially rounded outer region;
• dividing a single lithographic exposure shot area into a plurality of shot area portions;
• assigning a respective blinding mechanism shutter setting to each of the plurality of shot area portions of the single lithographic exposure shot area based on presence or absence of first and second die areas;
• and
• exposing the photoresist layer in the shot area through a mask to create a photolithographic image of a hole pattern on the wafer, including using the assigned shutter settings to provide greater exposure to shot area portions with second die areas than to shot area portions without second die areas;
• developing the exposed photoresist layer to form the hole pattern;
• and
• etching through the hole pattern into a dielectric layer to form the holes.