US 8,273,233 B2 · Method to reduce void formation during trapezoidal write pole plating in perpendicular recording

Abstract

A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (−) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.

Claims21

Dependent claims

A method of forming a write pole in a perpendicular magnetic recording head, comprising:

(a) forming an opening in a mold forming layer having a top surface, said opening has a bottom that exposes a portion of a substrate and has sidewalls that extend from the top surface to said substrate;
(b) forming a conformal Ru seed layer along the top surface and sidewalls, and on the bottom of the opening in a deposition chamber;
(c) depositing an auxiliary layer on the seed layer in the deposition chamber wherein said auxiliary layer conforms to a top surface of the seed layer and has a composition represented by CoxFeyNiz or oxides or alloys thereof wherein each of x, y, and z is from 0 to 100 atomic % and x+y+z=100 atomic %;
(d) removing all or a portion of the auxiliary layer in an electroplating solution;
and
(e) performing an electroplating process in said electroplating solution that deposits a magnetic material which fills said opening.

3 more elements

Dependencies are inferred from the claim text.

Method to reduce void formation during trapezoidal write pole plating in perpendicular recording

Life of this patent

Method to reduce void formation during trapezoidal write pole plating in perpendicular recording

Life of this patent

Abstract

Claims21