Back to results
US 8,263,316 B2Granted
Electronic device manufacture
AssigneeRohm and Haas Electronic Materials LLC
InventorMichael K. Gallagher
Life of this patent
Estimating the term…
Abstract
Electronic devices having a metal line-containing layer including an air gap region and a low-k dielectric material region where the air gap region includes a dense packing of metal lines is provided. Methods of forming such electronic devices are also provided.
Claims5
A method of forming an air gap in an electronic device comprising the steps of:
- a) disposing a layer of a sacrificial material on a substrate, wherein the sacrificial material is photodefineable;
- b) photodefining the sacrificial material to provide a first region and a second region, the regions having different solubility;
- c) removing one of the first and second regions to expose areas of the substrate;
- d) disposing an overlayer material on the remaining region of sacrificial material;
- and then e) removing the remaining region of sacrificial material through the overlayer material to form an air gap region;
- wherein the sacrificial material prior to photodefining comprises a cross-linked polymer.
3 more elements
Dependencies are inferred from the claim text.