Photosensitive resin composition and photosensitive film made with the same
AssigneeHitachi Chemical Company, Ltd.
InventorsKatsutoshi Itagaki, Naoki Sasahara, Takuji Abe, Yoshiki Ajioka
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AssigneeHitachi Chemical Company, Ltd.
InventorsKatsutoshi Itagaki, Naoki Sasahara, Takuji Abe, Yoshiki Ajioka
Estimating the term…
The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film (1) according to the invention comprises a support (11), resin layer (12) and protective film (13), where the resin layer (12) is composed of a photosensitive resin composition comprising a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a benzotriazole derivative represented by the following general formula (1). [wherein R11 and R12 each independently represent hydrogen or a monovalent organic group, and R13 represents a halogen atom, an alkyl, cycloalkyl, allyl, aryl, amino, alkylamino, nitro, cyano, mercapto, alkylmercapto, hydroxyl, hydroxyalkyl, carboxyl, carboxyalkyl, acyl or alkoxy group or a monovalent group with a heterocyclic ring, with the proviso that at least one of R11 and R12 is an optionally substituted aryl group or an organic group containing a C10 or greater hydrocarbon group.]
A photosensitive resin composition comprising;
A photosensitive resin composition comprising;
A photosensitive resin composition comprising;
Dependencies are inferred from the claim text.