Processing systems and methods for semiconductor devices
AssigneeInfineon Technologies AG
InventorLothar Doni
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Abstract
Systems and methods for processing semiconductor devices are disclosed. A preferred embodiment comprises a processing system that includes providing a processing system including a first container and a second container fluidly coupled to the first container, the second container being adapted to receive and retain an overflow amount of a fluid from the first container, and disposing the fluid in the first container and a portion of the second container. The method includes providing at least one semiconductor device, disposing the at least one semiconductor device in the first container, and maintaining the fluid in the second container substantially to a first level while processing the at least one semiconductor device with the fluid.
Claims22
A processing system comprising:
- a first container, the first container being adapted to contain a fluid and a semiconductor device;
- a second container fluidly coupled to the first container, the second container being adapted to receive and retain an overflow amount of a fluid from the first container;
- and
- a controller, wherein, while the semiconductor device and the fluid are contained within the first container, the controller is adapted to maintain the fluid to a substantially constant level in the second container by
- continuously flowing the fluid on an outer vertical sidewall of the first container thereby forming an evaporative vertical surface during an entire duration that the semiconductor device is contained in the first container, wherein the controller is adapted to maintain the continuous fluid flow by a continuous flow of deionized water into the first container during the entire duration that the semiconductor device is contained in the first container, and
- maintaining a height of the evaporative vertical surface by maintaining the fluid in the second container, wherein the controller is adapted to maintain the height by keeping the fluid between a first lower sensor and a second upper sensor, wherein the first lower and the second upper sensors are placed close to an upper edge of the first container, and wherein the controller is adapted to maintain the evaporative vertical surface is maintained during the entire duration that the semiconductor device is contained in the first container.
A processing system comprising:
- a first container configured to contain a fluid and a semiconductor device;
- a weir fluidly coupled to the first container, the first container being disposed within the weir, the weir comprising a second container disposed about a perimeter of the first container that is adapted to receive and retain an overflow amount of the fluid from the first container;
- and
- a controller configured to completely fill the first container and partially fill the weir with the fluid, the controller being configured to continuously flow the fluid on an outer vertical sidewall of the first container into the weir thereby forming an evaporative vertical surface, wherein the controller is adapted to maintain the continuous fluid flow by a continuous flow of deionized water into the first container during the entire duration that the semiconductor device is contained in the first container, wherein the controller is further configured to maintain a height of the evaporative vertical surface formed by the continuous fluid flow during the entire time that the semiconductor device is in the first container.
A processing system comprising:
- a first container adapted to contain a fluid and a semiconductor device;
- a weir fluidly coupled to the first container, the first container being disposed within the weir, the weir comprising a second container disposed about a perimeter of the first container that is adapted to receive and retain an overflow amount of the fluid from the first container, wherein the fluid comprises a solution of H3PO4 and deionized water;
- and
- a controller configured to completely fill the first container and partially fill the weir with the fluid, wherein the controller is adapted to maintain a continuous flow of H3PO4 and deionized water into the first container during an entire duration that the semiconductor device is disposed in the first container, wherein the controller is further adapted to maintain a continuous fluid flow on an outer vertical sidewall of the first container into the weir thereby forming an evaporative vertical surface, wherein the controller is adapted to maintain a height of the evaporative vertical surface formed by the continuous fluid flow during the entire duration that the semiconductor device is disposed in the first container.
An etching system comprising:
- a container adapted to support a semiconductor device;
- a weir fluidly coupled to the container, the container being disposed within the weir, the weir being disposed about at least a portion of a perimeter of the container, the weir being adapted to receive and retain an overflow amount of an etching fluid from the container;
- at least one sensor disposed within the weir, wherein a sensor of the at least one sensors is adapted to monitor a level of the etching fluid within the weir;
- means for maintaining a height of an evaporative vertical surface formed by a continuous flow of the etching fluid during an entire duration that the semiconductor device is supported in the container, wherein the means for maintaining height is adapted to maintain the continuous fluid flow by a continuous flow of deionized water into the container during the entire duration that the semiconductor device is contained in the container;
- means for obtaining information regarding the level of the etching fluid within the weir from the at least one sensor;
- and
- means for altering the etching fluid level in accordance with the information obtained, maintaining the etching fluid in the weir to a vertical level of a range of about 5 cm or less.
Dependencies are inferred from the claim text.