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US 8,262,435 B2Granted
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit
AssigneeJsr Corporation
InventorsEiichirou Kunitani, Atsushi Baba, Masayuki Motonari, Shoei Tsuji
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Abstract
A chemical mechanical polishing aqueous dispersion includes: (A) an amino acid, (B) abrasive grains, (C) a surfactant, (D) an oxidizing agent, and (E) ammonia, the ratio (WA/WD) of the content (WA) of the amino acid to the content (WD) of the oxidizing agent being 1.5 to 6.0, and the ratio (WE/WD) of the content (WE) of the ammonia to the content (WD) of the oxidizing agent being 0.05 to 0.6.
Claims7
A chemical mechanical polishing aqueous dispersion comprising:
- (A) an amino acid, (B) abrasive grains, (C) a surfactant, (D) an oxidizing agent, and (E) ammonia, the ratio (WA/WD) of the content (WA) of the amino acid to the content (WD) of the oxidizing agent being 1.5 to 6.0, and the ratio (WE/WD) of the content (WE) of the ammonia to the content (WD) of the oxidizing agent being 0.05 to 0.6.
Dependencies are inferred from the claim text.