Device and method for wet treating disc-like substrates
AssigneeLam Research Corporation
InventorsRainer Obweger, Alexander Pfeuffer, Martin Köffler, Alexander Lippert
Life of this patent
Estimating the term…
Abstract
A device for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.
Claims25
A device for wet treatment of wafers, comprising:
- a first plate;
- a second plate substantially parallel to said first plate;
- holding means for holding a wafer between said first and said second plate substantially parallel to said plates;
- first dispensing means for introducing fluid into a first gap between said first plate and a wafer when being treated;
- second dispensing means for introducing fluid into a second gap between said second plate and a wafer when being treated;
- at least one vibrating element acoustically coupled to at least said second plate;
- and
- rotating means for rotating said holding means and said second plate relative to each other about an axis substantially perpendicular to said second plate.
A device for wet treatment of wafers, comprising:
- a first plate;
- holding means for holding a wafer in a certain distance substantially parallel to said first plate;
- first dispensing means for introducing fluid into a first gap between said first plate and a wafer when being treated;
- at least one vibrating element acoustically coupled to said first plate;
- rotating means for rotating said holding means and said first plate relative to each other about an axis substantially perpendicular to said first plate;
- and
- adjustment-elements are provided in order to direct ultrasonic waves at an angle α′ of less than 89° to a wafer when treated wherein adjustment-elements comprise an array of a plurality of transducers with at least one ultrasonic generator to separately agitate said plurality of transducers in a phase-shifted way in order to generate an ultrasonic wave directed from said array of transducers at an angle α′ of less than 89°.
A device for wet treatment of wafers, comprising:
- a first plate;
- holding means for holding a wafer in a certain distance substantially parallel to said first plate;
- first dispensing means for introducing fluid into a first gap between said first plate and a wafer when being treated;
- at least one vibrating element acoustically coupled to said first plate;
- rotating means for rotating said holding means and said first plate relative to each other about an axis substantially perpendicular to a second plate;
- adjustment-elements provided in order to direct ultrasonic waves at an angle α′ of less than 89° to a wafer when treated with said second plate substantially parallel to said first plate and second dispensing means for introducing fluid into a second gap between said second plate and a wafer when being treated.
Dependencies are inferred from the claim text.