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AssigneeJX Nippon Mining & Metals Corporation
InventorsYousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
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A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.
A method of roughening a rolled copper or copper alloy foil to provide a roughened surface formed of fine copper particles on the foil, comprising a step of inhibiting formation of craters on the roughened surface caused by non-metal inclusions in the rolled copper or copper alloy foil by subjecting the rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate having a Cu equivalent of 1 to 50 g/L, 1 to 150 g/L of sulfuric acid, and one or more additives selected from the group consisting of sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2.
A method of roughening a rolled copper alloy foil, comprising a step of roughening plating the rolled copper alloy foil to produce a roughened surface formed of fine copper particles on the rolled copper alloy foil, the rolled copper alloy foil consisting of at least one element selected from the group consisting of Ag, Sn, Cr, Zr, Zn, Ni, Si, Mg, and Ti in a total amount of 0.03 to 5 wt % and remnant Cu and unavoidable impurities, and said roughening plating being performed by using a plating bath containing copper sulfate having a Cu equivalent of 1 to 50 g/L, 1 to 150 g/L of sulfuric acid, and one or more additives selected from the group consisting of sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2.
A method of roughening a rolled copper foil to provide a roughened surface formed of fine copper particles on the foil, comprising a step of inhibiting formation of craters on the roughened surface caused by non-metal inclusions in the rolled copper foil by subjecting the rolled copper foil to roughening plating with a plating bath containing copper sulfate having a Cu equivalent of 1 to 50 g/L, 1 to 150 g/L of sulfuric acid, and one or more additives selected from the group consisting of sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2.
Dependencies are inferred from the claim text.