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US 8,149,256 B2Granted
Techniques for changing temperature of a platen
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsRoger B. Fish, Samuel M. Barsky, Scott C. Holden, Arthur P. Riaf, Steven M. Anella
Life of this patent
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Abstract
Techniques for changing temperature of a platen are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for changing temperature of a platen comprising a platen and one or more movable thermal pads comprising one or more thermal fluid channels to carry a thermal fluid configured to affect a temperature of the platen.
Claims17
An apparatus comprising:
- an ion source configured to generate ions;
- a platen to support a wafer for ion implantation with the ions;
- and
- one or more movable thermal pads retractable away from the platen, the one or more movable thermal pads comprising one or more thermal fluid channels to carry a coolant configured to reduce a temperature of the platen so the temperature of the platen is below 0° C. during the ion implantation.
1 more element
A method for changing temperature of a platen, comprising:
- implanting ions into a wafer supported by a platen;
- feeding one or more thermal fluid channels of one or more movable thermal pads with a coolant;
- moving the one or more thermal pads to thermally contact the platen to reduce a temperature of the platen so the temperature of the platen is below 0° C. during the implanting operation;
- and
- retracting the one or more thermal pads when a desired temperature is obtained.
2 more elements
Dependencies are inferred from the claim text.