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US 8,149,080 B2Granted
Integrated circuit including inductive device and ferromagnetic material
AssigneeInfineon Technologies AG
InventorsBernhard Knott, Josef Höglauer, Uwe Jansen
Life of this patent
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Abstract
An integrated circuit includes a substrate and an inductive device on a first side of the substrate. The integrated circuit includes a first ferromagnetic material on a second side of the substrate opposite the first side.
Claims25
An integrated circuit comprising:
- a substrate comprising a circuit;
- an inductive device on a first side of the substrate;
- first ferromagnetic material on a second side of the substrate opposite the first side of the substrate, the first ferromagnetic material structured to provide gaps between portions of the first ferromagnetic material;
- and
- second ferromagnetic material over a first side and a second side of the inductive device, the first side of the inductive device directly contacting the second side of the inductive device,
- wherein the second ferromagnetic material over the first side directly contacts the second ferromagnetic material over the second side at an angle greater than or equal to 90° and less than 180°.
3 more elements
An integrated circuit comprising:
- a substrate comprising a circuit;
- a first inductive device on a first side of the substrate;
- a second inductive device over the first inductive device;
- a dielectric material directly contacting the first inductive device and the second inductive device, the dielectric material extending from the first inductive device to the second inductive device;
- and
- first ferromagnetic material printed over a first side and a second side of the first and second inductive devices, the first side of the inductive devices directly contacting the second side of the inductive devices,
- wherein first ferromagnetic material over the first side directly contacts the first ferromagnetic material over the second side at an angle greater than or equal to 90° and less than 180°.
4 more elements
An integrated circuit comprising:
- a substrate comprising a circuit;
- a first inductive device on a first side of the substrate;
- a second inductive device over the first inductive device;
- a dielectric material directly contacting the first inductive device and the second inductive device, the dielectric material extending from the first inductive device to the second inductive device;
- and
- ferromagnetic mold material encasing a first side and a second side of the first and second inductive devices, the first side of the inductive devices directly contacting the second side of the inductive devices,
- wherein the mold material encasing the first side directly contacts the mold material encasing the second side at an angle greater than or equal to 90° and less than 180°.
4 more elements
A method for fabricating an integrated circuit, the method comprising:
- providing a substrate comprising a circuit;
- fabricating an inductive device on a first side of the substrate;
- providing first ferromagnetic material on a second side of the substrate opposite the first side of the substrate;
- structuring the first ferromagnetic material to provide gaps between portions of the first ferromagnetic material;
- and
- providing second ferromagnetic material over a first side and a second side of the inductive device, the first side of the inductive device directly contacting the second side of the inductive device,
- wherein the second ferromagnetic material over the first side directly contacts the second ferromagnetic material over the second side at an angle greater than or equal to 90° and less than 180°.
4 more elements
A method for fabricating an integrated circuit, the method comprising:
- providing a substrate comprising a circuit;
- fabricating a first inductive device on a first side of the substrate;
- fabricating a second inductive device over the first inductive device;
- providing a dielectric material directly contacting the first inductive device and the second inductive device, the dielectric material extending from the first inductive device to the second inductive device;
- providing first ferromagnetic material between the first inductive device and the substrate;
- and
- covering a first side and a second side of the first and second inductive devices with second ferromagnetic material, the first side of the inductive devices directly contacting the second side of the inductive devices,
- wherein the second ferromagnetic material over the first side directly contacts the second ferromagnetic material over the second side at an angle greater than or equal to 90° and less than 180°.
5 more elements
Dependencies are inferred from the claim text.