Apparatus and method for terminating probe apparatus of semiconductor wafer

A probe apparatus for probing a semiconductor device by a tester, comprising:

• a probe that probes the semiconductor device mounted on a probe station;
• wherein the probe extends from a distal end to a proximal end of the probe, the distal end and the proximal end are conductively connected, and the probe comprises:
• a probe conductor;
• a dielectric layer, the dielectric layer being disposed around the probe conductor;
• a conductive coating layer, the conductive coating layer covering and being disposed around the probe dielectric layer;
• a conductive high temperature layer, the conductive high temperature layer being disposed around the conductive coating layer;
• and
• a strain relief device mounting the probe onto the probe station;
• a signal cable that carries a signal from the probe to the tester;
• a terminating device that terminates the proximal end of the probe with a distal end of the signal cable side by side;
• and
• a second conductive high temperature layer which is disposed between the probe and the probe station on a first side of the second conductive high temperature layer, disposed between the signal cable and the probe station on a second side of the second conductive high temperature layer, and disposed within an opening area of the probe station therebetween.