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US 8,148,845 B2Granted
Circuit assembly including a power semiconductor module and a controller
AssigneeInfineon Technologies AG
InventorReinhold Bayerer
Life of this patent
Estimating the term…
Abstract
A circuit assembly includes a power semiconductor module and, arranged externally thereto, a controller wherein the power semiconductor module comprises at least one controllable power semiconductor as well as at least one driver gating the latter, and controller and power semiconductor module each comprising a transceiver configured to communicate control signals between the controller and the power semiconductor module via an electromagnetic communication link unidirectionally or bidirectionally.
Claims22
A circuit assembly comprising:
- a power semiconductor module encapsulated in plastic comprising at least one controllable power semiconductor and at least one driver controlling the at least one power semiconductor and a power supply for the driver(s);
- and
- a controller arranged externally to the power semiconductor module;
- wherein the controller and the power semiconductor module each comprise a transceiver configured to communicate control signals between the controller and the at least one power semiconductor module via an electromagnetic communication link unidirectionally or bidirectionally;
- and
- wherein the power semiconductor module and the controller are both arranged on a heat sink being spaced away from each other.
3 more elements
A circuit assembly comprising:
- a power semiconductor module encapsulated in plastic comprising a controllable power semiconductor, a driver controlling the at least one power semiconductor, and a transceiver;
- and
- a controller arranged externally to the power semiconductor module and comprising a transceiver;
- wherein the controller and the power semiconductor module transceivers are configured to communicate control signals between the controller and the at least one power semiconductor module via an electromagnetic wireless communication link working in the high-frequency range;
- and
- wherein the power semiconductor module and the controller are both arranged on a heat sink being spaced away from each other.
3 more elements
A circuit assembly comprising:
- a power semiconductor module encapsulated in plastic comprising a transceiver, the power semiconductor module being segmented such that each segment comprises a controllable power semiconductor and a corresponding driver;
- and
- a controller arranged externally to the power semiconductor module and comprising a transceiver;
- wherein the controller and the power semiconductor module transceivers are configured to communicate control signals between the controller and the power semiconductor module via an electromagnetic communication link unidirectionally or bidirectionally;
- wherein a separate communication link is disposed between the controller and each segment;
- and
- wherein the power semiconductor module and the controller are both arranged on a heat sink being spaced away from each other.
4 more elements
A method of controlling a circuit comprising:
- arranging a controller externally to at least one power semiconductor module encapsulated in plastic, wherein the at least one power semiconductor module comprises a controllable power semiconductor, a driver controlling the at least one power semiconductor, and a transceiver;
- communicating control signals between the controller and the at least one power semiconductor module, the controller comprising a transceiver;
- configuring the controller and the power semiconductor module transceivers to communicate via an electromagnetic wireless communication link working in the high-frequency range;
- and
- configuring the power semiconductor module and the controller such that they are both arranged on a heat sink and are spaced away from each other.
2 more elements
Dependencies are inferred from the claim text.