Integrated circuit package system with leadfinger
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Lionel Chien Hui Tay, Jairus Legaspi Pisigan, Jeffrey D. Punzalan
Life of this patent
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Abstract
An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.
Claims20
An integrated circuit package system comprising:
- providing a lead terminal;
- forming a dummy lead near the lead terminal;
- positioning a base integrated circuit adjacent the lead terminal and the dummy lead;
- connecting a die connector to the base integrated circuit and the dummy lead;
- mounting a stackable integrated circuit over the base integrated circuit;
- and
- connecting another of the die connector to the stackable integrated circuit and the dummy lead.
An integrated circuit package system comprising:
- providing a lead terminal;
- forming a dummy lead near the lead terminal;
- positioning a base integrated circuit adjacent the lead terminal and the dummy lead;
- connecting a die connector to the base integrated circuit and the dummy lead;
- mounting a stackable integrated circuit over the base integrated circuit;
- connecting another of the die connector to the stackable integrated circuit and the dummy lead;
- and
- applying an encapsulant over the lead terminal, the dummy lead, the die connector, the base integrated circuit and the stackable integrated circuit.
An integrated circuit package system comprising:
- a lead terminal;
- a dummy lead near the lead terminal;
- a base integrated circuit adjacent the lead terminal and the dummy lead;
- a die connector to the base integrated circuit and the dummy lead;
- and
- a stackable integrated circuit over the base integrated circuit having another of the die connector attached to the stackable integrated circuit and the dummy lead.
Dependencies are inferred from the claim text.