Low loss package for electronic device
AssigneePicor Corporation
InventorsPatrizio Vinciarelli, Claudio Tuozzolo
Life of this patent
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Abstract
A package for one or more semiconductor die is described. A generally rectangular package includes two large terminals that occupy substantially the entire length of the package and provide low resistance connections. Additional connections may be provided preferably in a central portion of a short end of the package. BGA connections between the semiconductor die and the package substrate provide low impedance connections between the die and the package contacts. The package and connections facilitate current flow orthogonal to the longest package dimension maximizing conductor width and minimizing interconnection resistance.
Claims21
Apparatus comprising:
- a chip-scale package for semiconductor devices including
- a generally rectangular substrate having (i) three dimensions including a length, a width, and a thickness, (ii) each dimension being generally orthogonal to the other dimensions, (iii) the substrate length being greater than or equal to the substrate width;
- and (iv) length and width defining a first generally planar surface on which one or more semiconductor dice may be mounted and a generally planar second surface on which two or more conductive terminals may be formed, (v) the first and second surfaces having a first edge and a second edge defined by the substrate length;
- the second surface comprising a first zone and a second zone, the first and second zones each being generally rectangular in shape, having a zone length substantially equal to the substrate length and being located adjacent to the first and second edges, respectively, and having an area occupying substantially half of the second surface;
- a first terminal having a contact area disposed on the second surface, occupying substantially all of the first zone, and having an outside edge occupying substantially all of the first edge;
- a second terminal having a contact area disposed on the second surface, occupying substantially all of the second zone, and having an outside edge occupying substantially all of the second edge.
Dependencies are inferred from the claim text.