Multi-die DC-DC buck power converter with efficient packaging

An efficiently packaged multi-die semiconductor package for DC-DC buck converter application where the buck converter down converts an unregulated DC input into a regulated DC output, the multi-die semiconductor package comprises:

• a lead-frame having a first die pad thereon;
• a vertical MOSFET placed atop said first die pad;
• a Schottky diode with its cathode connected to the source of the vertical MOSFET;
• and
• a power regulating controller (PRC) for controlling the gate of the vertical MOSFET, wherein the PRC die is further attached to the first die pad via an insulating die bonding material to achieve a further reduced footprint of the first die pad with the vertical MOSFET, the Schottky diode and the PRC co-packaged atop the first die pad.

An efficiently packaged multi-die semiconductor package for DC-DC buck converter application where the buck converter down converts an unregulated DC input into a regulated DC output, the multi-die semiconductor package comprises:

• a lead-frame having a first die pad thereon;
• a vertical MOSFET placed atop said first die pad;
• a Schottky diode with its cathode connected to the source of the vertical MOSFET;
• and
• a power regulating controller (PRC) for controlling the gate of the vertical MOSFET, wherein both the unregulated DC input and the regulated DC output are negative voltages hence the vertical MOSFET is a vertical P-channel FET, the bottom of the Schottky diode die is its anode, the bottom of the vertical MOSFET is its source and the top of the vertical MOSFET has its gate and drain whereby the Schottky diode die and the vertical MOSFET die are co-packaged side by side atop the first die pad.