Molded stiffener for thin substrates

A method of securing a stiffener to a substrate, comprising:

• applying a stiffener material onto a first surface of a substrate to form a plurality of plastic stiffeners proximate a periphery of the substrate;
• and
• hardening the stiffener material wherein the plurality of plastic stiffeners are attached to the substrate without an adhesive element, and the substrate and the plastic stiffeners are separate components that are attached and secured together, said hardening comprising at least one of heating the stiffener material, cooling the stiffener material, curing the stiffener material by means of a catalyst, and curing the stiffener material by exposure to radiation.

A semiconductor device, comprising:

• a substrate comprising first and second surfaces, and a periphery;
• and
• a plurality of molded thermoplastic components attached to the first surface of the substrate proximate the periphery without an adhesive element, the plurality of molded thermoplastic components structured to stiffen the substrate and comprising at least one cross member, wherein the substrate and the stiffeners are separate components that are attached and secured together.

A semiconductor device, comprising:

• a substrate comprising first and second surfaces, and a periphery;
• a plurality of molded thermoplastic components attached to the first surface of the substrate proximate the periphery without an adhesive element, the plurality of molded thermoplastic components structured to stiffen the substrate and comprising at least one cross member, wherein the substrate and the stiffeners are separate components that are attached and secured together, and
• a die mounted on the first surface of the substrate.

A semiconductor device, comprising:

• a substrate comprising first and second surfaces, and a periphery;
• a plurality of molded thermoset plastic components attached to the first surface of the substrate proximate the periphery without an adhesive element, the plurality of molded thermoset plastic components structured to stiffen the substrate and comprising at least one cross member, wherein the substrate and the stiffeners are separate components that are attached and secured together, and
• a die mounted on the first surface of the substrate.

A semiconductor device, comprising:

• a substrate comprising first and second surfaces, and a periphery;
• a plurality of molded thermoplastic components attached to the first surface of the substrate without an adhesive element, the plurality of molded thermoset plastic components situated proximate the periphery and structured to stiffen the substrate and comprising at least one cross member, wherein the substrate and the stiffeners are separate components that are attached and secured together, and
• an element situated along the periphery of the substrate and structured for engagement with a processing mechanism for transporting the substrate.

A semiconductor device, comprising:

• a lead frame comprising first and second surfaces, and a periphery;
• a plurality of molded thermoplastic components attached to the first surface of the lead frame along the periphery to stiffen the lead frame and comprising at least one cross member, wherein the lead frame and the stiffeners are separate components that are attached and secured together, and
• a plurality of index holes proximate the periphery of the lead frame and structured for handling the lead frame by a processing mechanism.

A method of forming a semiconductor device, comprising:

• molding a plastic material onto a first surface of a substrate proximate a periphery of the substrate to form a plurality of molded plastic stiffeners attached to the first surface of the substrate without an adhesive element and comprising at least one cross member, wherein the substrate and the stiffeners are separate components that are attached and secured together.

A method of forming a semiconductor device, comprising:

• applying a plastic material onto a first surface of a substrate proximate a periphery of the substrate by a molding process to form a plurality of stiffeners comprising at least one cross member;
• and
• hardening the plastic material on the substrate to form the stiffeners attached to the first surface of the substrate without an adhesive element, wherein the substrate and the stiffeners are separate components that are attached and secured together.

A semiconductor device comprising:

• a plurality of molded plastic stiffeners attached to a first surface of a substrate without an adhesive element and comprising at least one cross member, wherein the substrate and the stiffeners are separate components that are attached and secured together.

A semiconductor device comprising:

• a plurality of molded plastic stiffeners in the form of a plate attached to a first surface of a substrate without an adhesive element, said plurality of stiffeners comprising at least one cross member;
• wherein the substrate and the stiffeners are separate components that are attached and secured together.

A semiconductor device comprising:

• a plurality of molded plastic stiffeners in the form of strips attached to a first surface of a substrate without an adhesive element;
• said plurality of stiffeners comprising at least one cross member, wherein the substrate and the stiffeners are separate components that are attached and secured together.

A semiconductor device comprising:

• a substrate with a plurality of strips of a molded plastic stiffener attached to a first surface of said substrate without an adhesive element, the strips of said stiffener comprising at least one cross member;
• wherein the substrate and the strips of said stiffeners are separate components that are attached and secured together.

A semiconductor device comprising:

• a plurality of stiffeners comprising a molded plastic stiffener component comprising at least one cross member attached to a first surface of a substrate without an adhesive element, the stiffener component effective to increase rigidity of the substrate, wherein the substrate and the stiffener component are separate components that are attached and secured together.