US 8,148,735 B2Granted

Optical communication module

AssigneeRohm Co., Ltd.

InventorsTomoharu Horio, Yuki Tanuma, Satoshi Nakamura, Kazumi Morimoto

Life of this patent

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Abstract

An infrared data communication module (A1) includes a substrate (1) consisting of a first layer (1A) and a second layer (1B), where the first layer is formed with a recess (11) open at its obverse surface, and includes the opening of the recess (11) and the second layer is fixed to the first layer (1A) on the side opposite from the opening. The module also includes a bonding conductor layer (6A) covering at least the bottom surface of the recess (11), a light emitting element (2) mounted on the bonding conductor layer (6A), and a heat dissipating conductor layer (6C) sandwiched between the first layer (1A) and the second layer (1B) and connected to the bonding conductor layer (6A).

An optical communication module comprising:

a substrate including a first layer and a second layer, the first layer being formed with a recess which has an opening at an obverse surface of the first layer, the second layer being laminated to the first layer on a side opposite from the opening;
a bonding conductor layer covering at least a bottom surface of the recess;
a light emitting element mounted on the bonding conductor layer;
a heat dissipating conductor layer sandwiched between the first layer and the second layer and connected to the bonding conductor layer;
a light receiving element for receiving light;
and
a resin package covering the light emitting element and the light receiving element, the resin package including a first lens carrying surface formed with a first dome-shaped lens portion facing one of the light emitting element and the light receiving element, the resin package also including a second lens carrying surface formed with a second lens portion facing the other of the light emitting element and the light receiving element, the first lens carrying surface being located lower than the second lens carrying surface and separated from the second lens carrying surface by an upright wall;
wherein the resin package is formed with an inclined portion connecting the first lens carrying surface of the resin package to a periphery of the first lens portion via a boundary and forming an obtuse angle with respect to the periphery of the first lens portion, an angle of inclination of the inclined portion with respect to the first lens carrying surface being smaller than an angle of inclination of the periphery of the first lens portion adjoining the boundary, a recessed space being defined by the inclined portion, the first lens carrying surface and the upright wall, and
wherein the recessed space includes a bottom surface defined by the first lens carrying surface, the bottom surface of the recessed space being located above the light receiving element.

6 more elements

Facts

Application

11/885,975Filed 6 Mar 2006

Priority

JP 2005-0617817 Mar 2005

Published

US 2009/0039377 A112 Feb 2009

Granted

3 Apr 2012

Term ends

Not estimatedThe source records don’t support an estimate.

Classification21 codes

H05K 1/0206
Using means for thermal conduction connection in the thickness direction of the substrate: by printed thermal vias
G02B 6/4272
Cooling: with mounting substrates of high thermal conductivity
H10F 55/155
Wherein the radiation-sensitive devices and the electric light source are all semiconductor devices: formed in, or on, a common substrate
H10F 77/407
Optical elements or arrangements: indirectly associated with the devices

Abstract

Claims23