Method of manufacturing semiconductor chips

A method of manufacturing semiconductor chips comprising:

• preparing a semiconductor wafer having a first and a second surface opposite to each other and having a recess portion and a rim portion, the semiconductor wafer having semiconductor elements formed on the first surface, the recess portion being surrounded by the rim portion, the recess portion and rim portion being composed of the first and second surfaces, the recess portion being formed so as to recede toward the first surface;
• applying a tape to the first surface side of the semiconductor wafer where the semiconductor elements are formed and placing the semiconductor wafer on a stage while making the first surface face toward the stage;
• radiating a laser beam from the second surface side to the recess portion along predetermined dicing lines;
• forming a metal electrode film to cover the second surface after radiating the laser beam to the recess portion along the dicing lines;
• applying a tape onto the semiconductor elements;
• and
• expanding the tape to cut off the recess portion so as to divide the semiconductor wafer into chips.