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US 8,147,712 B2Granted
Polishing composition
AssigneeMitsui Chemicals, Inc.
InventorsAkinori Etoh, Setsuko Oike, Shigeharu Fujii, Kiyotaka Shindo, Tomokazu Ishizuka
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Abstract
Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.
Claims11
A polishing composition containing a water-soluble resin,
- wherein said water-soluble resin comprises a copolymer obtained by polymerizing a methacrylamide and a vinyl monomer having at least one carboxyl group,
- wherein said water-soluble resin has a weight average molecular weight of 5,000 to 5,000,000, and
- wherein said water-soluble resin is contained in an amount of not less than 1 wt %, based on the total weight of the polishing composition.
Dependencies are inferred from the claim text.