Methods and systems for verifying sensor bond integrity

A system, comprising:

• a sensor operably coupled to a measuring circuit;
• and
• a sensing system, wherein the sensing system is configured for:
• selectively applying a thermal shock to the sensor;
• measuring an output voltage of the measuring circuit responsive to the thermal shock;
• and
• determining a percentage of bond between the sensor and an adjacent structure to which the sensor is affixed based on the measured output voltage.

A method of determining an amount of bond between a sensor and a structure, comprising:

• applying heat to a sensor bonded to a structure of interest during a time period sufficiently short to leave the structure of interest in a substantially unheated state;
• monitoring a physical parameter of the sensor to generate data responsive to the application of heat to the sensor;
• and
• determining an amount of bond between the sensor and a structure adjacent thereto based on the generated data.