Stress sensor and assembly method thereof

A stress sensor, comprising:

• a circuit board having a stress sensitive structure which includes a stress deformation region and a plurality of resistors located on the stress deformation region;
• a pointing stick disposed on a top of the circuit board and connected to the stress sensitive structure;
• and
• a metallic back plate including at least one fixing material coating region, and a plurality of fixing edges of the circuit board being fixed on the at least one fixing material coating region, at least one anti-spill hole being set in the at least one fixing material coating region of the metallic back plate.

A stress sensor, comprising:

• a circuit board having a stress sensitive structure which includes a stress deformation region and a plurality of resistors located on the stress deformation region, the top of the circuit board further comprising a plurality of junction parts disposed on the top of the circuit board for fixing to corresponding junction parts of a signal cable;
• a pointing stick disposed on a top of the circuit board and connected to the stress sensitive structure;
• and
• a metallic back plate including at least one fixing material coating region, and a plurality of fixing edges of the circuit board being fixed on the at least one fixing material coating region.

An assembly method for stress sensor for applying to a stress sensor, the stress sensor including a circuit board, a pointing stick and a metallic back plate having at least one fixing material coating region corresponding to a plurality of fixing edges of the circuit board, and the assembly method comprising:

• fixing the pointing stick to a top of the circuit board;
• fixing the fixing edges of the circuit board to the at least one fixing material coating region of the metallic back plate;
• fixing the stress sensor to a structure of an electronic device by a fixing means;
• and
• fixing a plurality of junction parts of a signal cable to a plurality of junction parts on the top of the circuit board.

An assembly method for stress sensor for applying to a stress sensor, the stress sensor including a circuit board, a pointing stick and a metallic back plate having at least one fixing material coating region corresponding to a plurality of fixing edges of the circuit board, a first fixing material being disposed in the at least one fixing material coating region, and the assembly method comprising:

• fixing the pointing stick to a top of the circuit board;
• fixing the fixing edges of the circuit board to the at least one fixing material coating region of the metallic back plate by a second fixing material, and the second fixing material is connected to the first fixing material;
• fixing the stress sensor to a structure of an electronic device by a fixing means;
• and
• fixing a plurality of junction parts of a signal cable to a plurality of junction parts on the top of the circuit board.