US 8,146,438 B2 · Pressure-sensitive adhesive sheet for testing

Abstract

Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Claims15

Dependent claims

A pressure-sensitive adhesive sheet for testing comprising a base film and only a single pressure-sensitive adhesive layer provided on the base film, wherein

the base film and the pressure-sensitive adhesive layer have conductivity, and an electrically conductive path is provided therebetween.

The pressure-sensitive adhesive sheet for testing comprising a base film and a pressure-sensitive adhesive layer provided on the base film, wherein the base film and the pressure-sensitive adhesive layer have conductivity, and an electrically conductive path is provided therebetween, and wherein the pressure-sensitive adhesive layer has a laminated structure in which a first conductive pressure-sensitive adhesive layer and a second conductive pressure-sensitive adhesive layer are laminated one by one from the base film side,

the surface resistivity of the first conductive pressure-sensitive adhesive layer is 1×10−2 Ω/□ to 1 Ω/□, the surface resistivity of the second conductive pressure-sensitive adhesive layer is 1×10−1 Ω/□ to 1×101 Ω/□, the adhesive strength of the first conductive pressure-sensitive adhesive layer is 1 N/20 mm or less, the adhesive strength of the second conductive pressure-sensitive adhesive layer is 1 N/20 mm or more, and the adhesive strength of the first conductive pressure-sensitive adhesive layer is smaller than the adhesive strength of the second conductive pressure-sensitive adhesive layer.

Dependencies are inferred from the claim text.

Facts

Application

12/513,230Filed 9 Oct 2008

Priority

JP 2007-2912528 Nov 2007

Published

US 2010/0313667 A116 Dec 2010

Granted

3 Apr 2012

Term ends

Not estimatedThe source records don’t support an estimate.

Classification31 codes

G01R 1/0735
With individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or…:…
B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 27/08
As the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 27/18
Layered products comprising a layer of synthetic resin: characterised by the use of special additives

Pressure-sensitive adhesive sheet for testing

Life of this patent

Pressure-sensitive adhesive sheet for testing

Life of this patent

Abstract

Claims15