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US 8,146,437 B2Granted
Diaphragm structure and MEMS device
AssigneePanasonic Corporation
InventorsYuichi Miyoshi, Yusuke Takeuchi, Tohru Yamaoka, Hiroshi Ogura
Life of this patent
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Abstract
A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.
Claims14
A diaphragm structure, comprising:
- a substrate having a through-hole formed so as to penetrate from an upper surface to a bottom surface of the substrate;
- and
- a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole, wherein:
- an opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal,
- the substrate is a silicon substrate, and
- an opening shape of the through-hole in the bottom surface of the substrate is substantially rhombic.
3 more elements
A MEMS device, comprising:
- a substrate having a through-hole formed so as to penetrate from an upper surface to a bottom surface of the substrate;
- a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole;
- a fixed electrode formed above the substrate so as to oppose to the vibrating electrode film with an air gap being interposed therebetween;
- and
- a plurality of holes formed in the fixed electrode, wherein:
- an opening shape of the through-hole in the upper surface of the substrate is substantially-hexagonal,
- the substrate is a silicon substrate, and
- an opening shape of the through-hole in the bottom surface of the substrate is substantially rhombic.
5 more elements
Dependencies are inferred from the claim text.