Method of aligning components for installation on a head suspension assembly
AssigneeHutchinson Technology Incorporated
InventorRaymond R. Wolter
Life of this patent
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Abstract
A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.
Claims4
A method of manufacturing a head suspension assembly for supporting a head slider over a storage media in a dynamic storage device of the type having a spring metal layer, an electrically conductive layer, and a dielectric layer interposed between the metal layer and the electrically conductive layer, and a plurality of traces formed in the electrically conductive layer and terminating in bond pads adjacent a slider mounting surface, the method comprising the steps of:
- forming a datum feature in the electrically conductive layer adjacent to the bond pads and spaced apart from the slider mounting surface;
- installing the head slider at the slider mounting surface;
- determining the coordinates of the head slider relative to the datum feature;
- and
- discarding the head suspension assembly if the coordinates of the head slider are not within preset ranges.
Dependencies are inferred from the claim text.