TCP-type semiconductor device and method of testing thereof
AssigneeRenesas Electronics Corporation
InventorSuguru Sasaki
Life of this patent
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Abstract
A TCP-type semiconductor device has: a base film; a semiconductor chip mounted on the base film; and a plurality of leads formed on the base film. Each lead has: a first terminal portion including a first end that is one end of the each lead and connected to the semiconductor chip; and a second terminal portion including a second end that is the other end of the each lead and located on the opposite side of the first terminal portion. I a terminal region including the second terminal portion of the each lead, the plurality of leads are parallel to each other along a first direction, the plurality of leads include a first lead and a second lead that are adjacent to each other, and the first lead and the second lead are different in a position of the second end in the first direction.
Claims20
A TCP-type (Tape Carrier Package-type) semiconductor device, comprising:
- a base film;
- a semiconductor chip mounted on said base film;
- and
- a plurality of leads formed on said base film,
- wherein each of said plurality of leads comprises:
- a first terminal portion including a first end that is one end of said each lead and connected to said semiconductor chip;
- and
- a second terminal portion including a second end that is an other end of said each, lead and located on an opposite side of said first terminal portion,
- wherein in a terminal region including said second terminal portion of said each lead, said plurality of leads is parallel to each other along a first direction, said plurality of leads includes a first lead and a second lead that are adjacent to each other, and said first lead and said second lead are different in a position of said second end in said first direction, and
- wherein a longest lead in said plurality of leads comprises a notch that faces with at feast a part of a shortest lead in said plurality of leads such that said notch provides a space between the shortest lead and the longest lead.
A TCP-type (Tape Carrier Package-type) semiconductor device, comprising:
- a base film;
- a semiconductor chip mounted on said base film;
- and
- a plurality of lead groups formed on said base film,
- wherein each of said plurality of lead groups comprises a predetermined number of leads,
- wherein each of said predetermined number of leads comprises:
- a first terminal portion including a first end that is one end of said each lead and connected to said semiconductor chip;
- and
- a second terminal portion including a second end that is an other end of said each lead and located on an opposite side of said first terminal portion,
- wherein in a terminal region including said second terminal portion of said each lead, said predetermined number of leads are parallel to each other along a first direction, and said predetermined number of leads are different in a position of said second end in said first direction, and
- wherein said plurality of lead groups comprises a first lead group and a second lead group each comprising a shortest lead and a longest lead, said longest lead of the first lead group comprising a notch that faces with at least a cart of the shortest lead of the second lead group such that said notch provides a space between the shortest lead of the second lead group and the longest lead of the first lead group.
A method of testing a TCP-type (Tape Carrier Package-type) semiconductor device by using a probe card, wherein said TCP-type semiconductor device comprises:
- a base film;
- a semiconductor chip mounted on said base film;
- and
- a plurality of lead groups formed on said base film,
- wherein each of said plurality of lead groups comprises a predetermined number of leads,
- wherein each of said predetermined number of leads comprises:
- a first terminal portion including a first end that is one end of said each lead and connected to said semiconductor chip;
- and
- a second terminal portion including a second end that is an other end of said each lead and located on an opposite side of said first terminal portion,
- wherein in a terminal region including said second terminal portion of said each lead, said predetermined number of leads are parallel to each other along a first direction, and said predetermined number of, leads are different in a position of said second end in said first
- wherein said plurality of lead groups comprises a first lead group comprising a shortest lead and a second lead group comprising a longest lead, said longest lead comprising a notch that faces with at least a part of the shortest lead such that said notch provides a space between the shortest lead and the longest lead,
- wherein said probe card comprises a plurality of probe groups that respectively come in contact with said plurality of lead groups, each of said plurality of probe groups comprises a predetermined number of probes that respectively come in contact with said predetermined number of leads, and respective ends of said predetermined number of probes are different in a position in said first direction, the method comprising:
- bringing said predetermined number of probes of said plurality of probe groups into contact with said predetermined number of leads of said plurality of lead groups, respectively;
- and
- supplying a test signal to said semiconductor chip or retrieving an output signal from said semiconductor chip through said probe card and said plurality of lead groups.
Dependencies are inferred from the claim text.