Methods for forming semiconductor light emitting devices and submounts
AssigneeCree, Inc.
InventorsBernd Keller, James Ibbetson, Peter Andrews, Gerald H. Negley, Norbert Hiller
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Abstract
A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.
Claims24
A method of packaging a semiconductor light emitting device, comprising:
- disposing the light emitting device on a submount;
- and
- positioning a solid wavelength conversion member on the submount over the light emitting device and displaced therefrom to receive and wavelength convert light emitted from the light emitting device, wherein the wavelength conversion member comprises a lens having a predetermined optical transmission pattern and wherein the light emitting device has an optical emission pattern associated with a chip shape of the light emitting device and the positioned solid wavelength conversion member provides the packaged semiconductor light emitting device a selected optical pattern based on the optical transmission pattern and the optical emission pattern.
A method, comprising:
- providing a semiconductor substrate comprising a mounting location configured to receive a light emitting device;
- providing a first conductive path extending from the mounting location to an external surface of the substrate;
- providing a second conductive path extending from the mounting location to an external surface of the substrate, wherein the first conductive path and the second conductive path include doped regions;
- providing a first bond pad on the mounting location on an end of the first conductive path extending therefrom;
- providing a second bond pad on the mounting location on an end of the second conductive path extending therefrom.
A method, comprising:
- providing a plurality of light emitting devices, each of which has an associated predetermined light emitting device output;
- providing a plurality of wavelength conversion members, each of which has an associated predetermined wavelength conversion characteristics;
- and
- matching one of the light emitting devices with one of the wavelength conversion members based on their respective associated light emitting device output and wavelength conversion characteristic;
- wherein matching includes selecting the matched ones of the wavelength conversion members to have wavelength conversion characteristics that differ based on differences in the associated light emitting device output of their respective ones of the light emitting devices and wherein the wavelength conversion characteristic comprises an optical transmission pattern and wherein the associated light emitting device output comprises an optical emission pattern associated with an associated chip shape of the light emitting devices.
Dependencies are inferred from the claim text.