Temperature setting method and apparatus for a thermal processing plate

A temperature setting apparatus for a thermal processing plate mounting and thermally processing a substrate thereon,

• said thermal processing plate being divided into a plurality of regions, and a temperature being capable of being set for each of the regions, and
• a temperature correction value for adjusting an in-plane temperature of said thermal processing plate being capable of being set by said temperature setting apparatus for each of the regions of said thermal processing plate, said temperature setting apparatus comprising:
• a data storage unit storing, from states of an etching pattern within the substrate measured for a substrate for which a series of photolithography processing including the thermal processing on said thermal processing plate and an etching treatment thereafter have been finished, a function relating correction amounts for the states of the etching pattern to the temperature correction values for said thermal processing plate;
• and
• a program storage unit storing a program to calculate the temperature correction values for the regions of said thermal processing plate using the function, and set the temperature for each of the regions of said thermal processing plate by each of the calculated temperature correction values.

A non-transitory computer-readable storage medium storing a program running on a computer of a control unit controlling a temperature setting apparatus to cause the temperature setting apparatus to execute a temperature setting method for a thermal processing plate,

• the thermal processing plate being divided into a plurality of regions, and a temperature being capable of being set for each of the regions, and
• a temperature correction value for adjusting an in-plane temperature of the thermal processing plate being capable of being set for each of the regions of the thermal processing plate,
• said method comprising the steps of:
• measuring states of an etching pattern within the substrate for a substrate for which a series of photolithography processing including the thermal processing on the thermal processing plate and an etching treatment thereafter have been finished;
• calculating the temperature correction values for the regions of the thermal processing plate from measurement result of the states of the etching pattern within the substrate using a function between correction amounts for the states of the etching pattern and the temperature correction values for the thermal processing plate;
• and
• setting the temperature for each of the regions of the thermal processing plate by each of the calculated temperature correction values.