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US 8,134,196 B2Granted
Integrated circuit system with metal-insulator-metal circuit element
AssigneeSTATS ChipPAC, Ltd.
InventorsYaojian Lin, Haijing Cao, Wan Lay Looi, Eng Seng Lim
Life of this patent
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Abstract
An integrated circuit system is provided including forming a substrate, forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers on other layers of the multiple conductive layers, forming a dielectric layer on the first contact, and forming a second contact on the dielectric layer and over the first contact.
Claims20
A method of manufacturing an integrated circuit comprising:
- forming a substrate;
- forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers directly contacts and covers other layers of the multiple conductive layers, wherein the other layers of the multiple conductive layers are entirely planar and the other layers having a first conductive layer, a second conductive layer, and a third conductive layer, with the first conductive layer 15 to 5 times thicker than the second conductive layer and the third conductive layer 5 to 15 times thicker than the second conductive layer;
- forming a dielectric layer on the first contact;
- and
- forming a second contact on the dielectric layer and over the first contact.
2 more elements
A method of manufacturing an integrated circuit comprising:
- forming a substrate;
- forming a first conductive layer that is entirely planar over the substrate;
- forming a second conductive layer that is entirely planar on the first conductive layer with the second conductive layer 15 to 5 times thinner than the first conductive layer;
- forming a third conductive layer that is entirely planar on the second conductive layer with the third conductive layer 5 to 15 times thicker than the second conductive layer;
- forming a fourth conductive layer directly contacting and covering the third conductive layer, the second conductive layer, and the first conductive layer;
- forming a dielectric layer on the fourth conductive layer;
- and
- forming an electrode on the dielectric layer and over the third conductive layer.
5 more elements
An integrated circuit system comprising:
- a substrate;
- a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers directly contacts and covers other layers of the multiple conductive layers, wherein the other layers of the multiple conductive layers are entirely planar and the other layers having a first conductive layer, a second conductive layer, and a third conductive layer, with the first conductive layer 15 to 5 times thicker than the second conductive layer and the third conductive layer 5 to 15 times thicker than the second conductive layer;
- a dielectric layer on the first contact;
- and
- a second contact on the dielectric layer and over the first contact.
2 more elements
Dependencies are inferred from the claim text.