Substrate processing apparatus and substrate transfer method adopted in substrate processing apparatus
AssigneeTokyo Electron Limited
InventorTatsuya Ogi
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AssigneeTokyo Electron Limited
InventorTatsuya Ogi
Estimating the term…
In a substrate processing apparatus according to the present invention, wafer transfer timing with which wafers are to be transferred to individual processing chambers from a cassette container is determined in correspondence to each processing chamber, based upon the lengths of time required to process a single wafer in the processing chambers. Then, wafers are transferred from the cassette container in conformance to the transfer timing thus determined. By setting the wafer transfer timing with which wafers are transferred from the cassette container in coordination with the lengths of processing time at the individual processing chambers, the operation rates in the processing chambers are improved and ultimately, the throughput of the apparatus is improved.
A substrate processing apparatus comprising:
A substrate transfer method adopted in a substrate processing that includes a processing unit having a plurality of processing chambers where substrates undergo a specific type of processing, a transfer unit connected to said processing unit, a transfer unit-side transfer mechanism disposed at said transfer unit, which transfers the substrate stored in a substrate storage container to said processing unit and a processing unit-side transfer mechanism disposed at said processing unit, which transfers the substrates having been transferred from said transfer unit into said processing chambers, comprising:
Dependencies are inferred from the claim text.