Heat sink, semiconductor device, and method of manufacturing heat sink
AssigneeNEC Electronics Corporation
InventorHarumi Mizunashi
Life of this patent
Estimating the term…
Abstract
A heat sink 109 is configured by a plate component having a combined structure composed of a recess and a projection formed thereon, wherein the recess is formed by allowing a part of the plate component to be set back from the surface level of the residual region, and the projection is formed on one surface of the plate component with the progress of formation of the recess, so as to be built up above the level of the residual region of the one surface.
Claims28
A heat sink configured by a plate component including a combined structure comprising a recess and a projection formed thereon, said recess being formed such that a part of said plate component is set back from a surface level of a residual region of said plate component, and said projection being formed on one surface of said plate component with a progress of formation of said recess, to project outwardly from the surface level of the residual region such that an upper surface of said projection extends from said one surface of said plate component to a sidewall of said recess.
A semiconductor device, comprising:
- a substrate;
- a semiconductor element mounted on said substrate;
- and
- a heat sink disposed over said semiconductor element,
- wherein said heat sink configured by a plate component including a combined structure comprising a recess and a projection formed thereon, said recess being formed such that a part of said plate component is set back from a surface level of a residual region of said plate component, and said projection being formed on one surface of said plate component with a progress of formation of said recess, to project outwardly from the surface level of the residual region such that an upper surface of said projection extends from said one surface of said plate component to a sidewall of said recess.
A method of manufacturing a heat sink configured by a plate component, said method comprising:
- forming a recess by allowing a part of said plate component to be set back from a surface level of a residual region of said plate component;
- and
- forming a projection on one surface of said plate component with a progress of formation of said recess to project outwardly from the surface level of the residual region such that an upper surface of said projection extends from said one surface of said plate component to a sidewall of said recess, to thereby form a combined structure comprising said recess and said projection.
Dependencies are inferred from the claim text.